Waste Heat to Electric Semiconductor Chip Solution named as one of the top Innovations at the upcoming TechConnect World Summit, National Innovation Summit and Showcase (NISS) and National SBIR conference being held May 12 -16 in Washington, DC.
AUSTIN, TX MAY 08, 2013 MTPV Power Corporation (https://www.mtpv.com) received the TechConnect National Innovation Award. TechConnect announced the annual TechConnect Innovation Awards in connection with its upcoming Annual Summit. The TechConnect Innovation Awards identify the top technologies as ranked by the TechConnect Corporate & Investment Partner Committee. Innovation rankings are based on the potential positive impact the submitted technology will have on a specific industry sector. Innovations are submitted from global academic technology transfer offices, early-stage companies, small business innovative research (SBIR) awardees, and government and corporate research laboratories.
MTPV previously received the award for “Best Venture” by the U.S. Department of Energy’s National Renewable Energy Laboratory’s Industry Growth Forum and received the Platinum award and top honors from the WBT Innovation Technology Forum. In addition to these recognitions MTPV has also been named a Finalist by the Department of Energy’s ARPA-E division and has also been awarded a grant from the National Science Foundation.
MTPV creates semiconductor chips that covert heat directly into electricity. Much like a solar panel will convert sunlight into electricity, MTPV chips are able to convert any source of heat into electricity with breakthrough efficiency and power. In addition to presenting at the annual summit which is also co-sponsored by the National Innovation Summit and Showcase (NISS) and National SBIR conference, MTPV will also be exhibiting at the event and can be found in booth number 921 during the expo.
“This award is testament to the years of hard work of the MTPV team,” said Brian Hubert, Associate Investment Manager at Applied Ventures LLC, the venture capital arm of Applied Materials, Inc., one of MTPV’s investors. “We look forward to the positive impact their innovative technology will have on the energy and semiconductor industries.”
TechConnect is a global technology outreach & development organization. They vet and deliver the world’s most promising technologies to the world’s top corporate, government and investment professionals.
About MTPV Power Corporation (https://www.mtpv.com)
MTPV is a clean energy semiconductor chip company using its breakthrough technology to harness the world’s waste heat and convert it to electricity. For more information, visit https://www.mtpv.com
About TechConnect (http://www.techconnect.org)
TechConnect is a global technology outreach & development organization. Through our innovative programs and conferences, we deliver the most promising technologies to the world’s top corporate, investment, and government professionals. TechConnect is headquartered in Austin, Texas, with offices in Cambridge, Massachusetts and Danville, California. For more information, visit: http://nationalinnovationsummit.com
About Applied Ventures
Applied Ventures, LLC, a subsidiary of Applied Materials, Inc., invests in early stage technology companies with high growth potential that provide a window on technologies that advance or complement Applied Materials’ core expertise. Applied Ventures’ investments help develop technologies and markets that provide natural extensions of Applied Materials’ businesses and can stimulate the growth of applications for its products and services. Applied Materials, Inc. is the global leader in providing innovative equipment, services and software to enable the manufacture of advanced semiconductor, flat panel display and solar photovoltaic products. Learn more at http://www.appliedventures.com.
About the National Innovation Summit & Showcase
TechConnect presents the National Innovation Summit & Showcase, the nation’s top innovations emerging from our federal technology funding programs. All showcasing innovations are vetted by our industry and investment review Committees, and all will participate in the TechConnect Corporate Acceleration and Matchmaking Programs with our participating Corporate and Investment Partners.